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EPXA4F672I2
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Item specifics
- Core Type 32-Bit ARM9
- Data SRAM Bytes 64K
- ECCN Code 3A001.A.7.A
- EEPROM Size --
- FPGA Core Cells 16640
- FPGA Gates 400K
- FPGA SRAM --
- Frequency 200 MHz
- HTS Code 8542.39.00.01
- Ihs Manufacturer INTEL CORP
- Interface EBI/EMI, UART/USART
- JESD-30 Code S-PBGA-B672
- JESD-609 Code e0
- Length 27 mm
- Manufacturer Intel Corporation
- Manufacturer Part Number EPXA4F672I2
- Max Operating Temperature 100 °C
- Min Operating Temperature -40 °C
- Moisture Sensitivity Level 3
- Mount Surface Mount
- Mounting Type Surface Mount
- Number of I/O Lines 426
- Number of Logic Blocks (LABs) 16640
- Number of Logic Elements/Cells 16640
- Number of Pins 672
- Number of Terminals 672
- Operating Supply Voltage 1.8 V
- Operating Temperature -40°C ~ 100°C
- Organization 0 DEDICATED INPUTS, 426 I/O
- Output Function MACROCELL
- Package / Case 672-BBGA, FCBGA
- Package Body Material PLASTIC/EPOXY
- Package Code BGA
- Package Description BGA,
- Package Shape SQUARE
- Package Style GRID ARRAY
- Packaging Tray
- Part Life Cycle Code Obsolete
- Part Status Obsolete
- Peak Reflow Temperature (Cel) 220
- Program SRAM Bytes 128K
- Programmable Logic Type LOADABLE PLD
- Qualification Status Not Qualified
- Reach Compliance Code compliant
- Reflow Temperature-Max (s) 30
- Risk Rank 5.79
- RoHS Compliant
- Rohs Code No
- Seated Height-Max 2.1 mm
- Series Excalibur™
- Speed 200MHz
- Supplier Device Package 672-FBGA (27x27)
- Supply Voltage-Max 1.89 V
- Supply Voltage-Min 1.71 V
- Supply Voltage-Nom 1.8 V
- Surface Mount YES
- Terminal Finish TIN LEAD
- Terminal Form BALL
- Terminal Pitch 1 mm
- Terminal Position BOTTOM
- Voltage - Supply 1.8V
- Width 27 mm
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